壓盤(pán)泵打膠機(jī)如何控制膠量？
我們?cè)谶M(jìn)行電源灌膠時(shí)，必須根據(jù)電源的需要灌膠的基體去控制膠灌的大小而達(dá)到灌封的目的，進(jìn)行電源灌封時(shí)要注意不能少膠的同時(shí)不能溢膠。下面，
壓盤(pán)泵廠家來(lái)說(shuō)說(shuō)如何在進(jìn)行電源灌封機(jī)時(shí)控制灌膠的大小，提升灌膠的質(zhì)量。
When pouring glue into power supply, we must control the size of glue pouring according to the needs of power supply to achieve the purpose of pouring. When pouring power supply, we should pay attention to not less glue and no overflow. Next, the pressure plate pump manufacturers to talk about how to control the size of the filling glue in the power supply filling machine, and improve the quality of the glue.
在講關(guān)于自動(dòng)灌膠機(jī)膠灌的大小的前提下，伙伴們要了解灌膠針頭與電路板的距離以及針頭內(nèi)徑是重要的參數(shù)。壓盤(pán)泵廠家提醒各位小伙伴，如果針頭和基板之間的距離不正確的話，操作人員將永遠(yuǎn)無(wú)法得到正確的灌膠結(jié)果。
On the premise of the size of the automatic glue filling machine, partners should understand that the distance between the glue filling needle and the circuit board and the inner diameter of the needle are important parameters. The pressure plate pump manufacturer reminds you that if the distance between the needle and the substrate is not correct, the operator will never get the correct glue filling result.
在其他參數(shù)不變的情況下，如果灌膠針越大，膠灌直徑就越小，膠灌高度就越高;灌膠針頭與電路板的距離越小，膠灌直徑就越大，膠灌高度就越低。
With other parameters unchanged, if the larger the glue filling needle is, the smaller the glue filling diameter is and the higher the glue pouring height is; the smaller the distance between the glue filling needle and the circuit board is, the larger the glue pouring diameter is and the lower the glue pouring height is.
膠灌的直徑是由針頭內(nèi)徑和針頭與基板的距離決定的。當(dāng)針頭內(nèi)徑相同時(shí)，如果改變針頭和基板之間的距離，雖然灌的膠量完全相同，也可能得到不同的膠灌直徑和膠灌形狀。
The diameter of the glue filling is determined by the inner diameter of the needle and the distance between the needle and the substrate. When the inner diameter of the needle is the same, if the distance between the needle and the substrate is changed, although the amount of glue poured is the same, different diameter and shape of glue pouring may be obtained.
但通過(guò)改變膠針的高度而改變膠灌直徑也有一定的范圍限制。灌膠直徑是不可能小于甚等于所使用針頭內(nèi)徑的。這是由于膠和針頭之間表面張力(f1)與膠和基板之間的表面張力(f1)二者相對(duì)作用力所致。
However, there is a certain limit to change the diameter of glue filling by changing the height of glue needle. It is impossible for the glue filling diameter to be less than or equal to the inner diameter of the needle used. This is due to the relative force of the surface tension (F1) between the glue and the needle and the surface tension (F1) between the glue and the substrate.
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